规格参数 > 第10454页
70T3319S200BC8 现货价格参数; DW-32-12-G-T-665 现货价格参数; RWR80S90R9FSB12 现货价格参数; 70T659S15DR 现货价格参数; MAX6479BL33AD2-T 现货价格参数; DW-32-19-S-D-920 现货价格参数; RWR81N1R00FRS73 现货价格参数; 70V05L20PFI8 现货价格参数; DW-35-08-G-D-200 现货价格参数; 1N3595JTXV 现货价格参数;
型号 | 生产商 | 产品描述 |
---|---|---|
70T3319S200BC8 | integrated device technology (idt) | SRAM Chip Sync Dual 2.5V 4M-Bit 256K x 18 10ns/3.4ns 256-Pin CABGA T/R |
DW-32-12-G-T-665 | samtec inc. | Conn Board Stacker HDR 96 POS 2.54mm Solder ST Thru-Hole |
RWR80S90R9FSB12 | vishay / dale | Res Wirewound 90.9 Ohm 1% 2W ±20ppm/°C 0.001% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
70T659S15DR | integrated device technology (idt) | SRAM Chip Async Dual 2.5V 4.5M-Bit 128K x 36 15ns 208-Pin PQFP |
MAX6479BL33AD2-T | Maxim Integrated | Low Dropout Regulators - LDO |
DW-32-19-S-D-920 | samtec inc. | Conn Board Stacker HDR 64 POS 2.54mm Solder ST Thru-Hole |
RWR81N1R00FRS73 | vishay / dale | Res Wirewound 1 Ohm 1% 1W ±400ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
70V05L20PFI8 | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 64K-Bit 8K x 8 20ns 64-Pin TQFP T/R |
DW-35-08-G-D-200 | samtec inc. | Conn Board Stacker HDR 70 POS 2.54mm Solder ST Thru-Hole |
1N3595JTXV | rochester electronics | |
70V08S35PF8 | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 512K-Bit 64K x 8 35ns 100-Pin TQFP T/R |
RWR81N2320FRB12 | vishay / dale | Res Wirewound 232 Ohm 1% 1W ±20ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
DW-36-08-S-D-200 | samtec inc. | Conn Board Stacker HDR 72 POS 2.54mm Solder ST Thru-Hole |
70V24L20PFI8 | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 64K-Bit 4K x 16 20ns 100-Pin TQFP T/R |
1.5KE150CA | Taiwan Semiconductor | TVS Diodes - Transient Voltage Suppressors 150V 1.5KW 5% Bidir |
DW-36-09-L-D-375 | samtec inc. | Conn Board Stacker HDR 72 POS 2.54mm Solder ST Thru-Hole |
RWR89N1R00FRB12 | vishay / dale | Res Wirewound 1 Ohm 1% 3W ±400ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
70V3389S6BC8 | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 1.125M-Bit 64K x 18 6ns 256-Pin CABGA T/R |
DW-36-11-L-S-705 | samtec inc. | Conn Board Stacker HDR 36 POS 2.54mm Solder ST Thru-Hole |
1N4307MJTX | rochester electronics | |
70V3569S5BFI | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 576K-Bit 16K x 36 5ns 208-Pin CABGA |
RF2663-000 | te connectivity / raychem circuit protection | PTC Resettable Fuse 40A 72V T/R |
DW-36-13-S-D-600 | samtec inc. | Conn Board Stacker HDR 72 POS 2.54mm Solder ST Thru-Hole |
70V3599S133BCI | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 4.5M-Bit 128K x 36 15ns/4.2ns 256-Pin CABGA |
1N4686 | rochester electronics | |
RF2661-000 | te connectivity / raychem circuit protection | RESET,60V,40A,0.65A IHLD,1.3A ITRP,RADIAL,AMM,HAZMAT |
DW-40-08-T-S-300 | samtec inc. | Conn Board Stacker HDR 40 POS 2.54mm Solder ST Thru-Hole |
70V3599S166BF8 | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 4.5M-Bit 128K x 36 12ns/3.6ns 208-Pin CABGA T/R |
RF2671-000 | te connectivity / raychem circuit protection | PTC Resettable Fuse 40A 72V Bulk |
DW-44-10-S-S-470 | samtec inc. | Conn Board Stacker HDR 44 POS 2.54mm Solder ST Thru-Hole |
70V5388S166BC8 | integrated device technology (idt) | SRAM Chip Sync Quad 3.3V 1.125M-Bit 64K x 18 3.2ns 256-Pin CABGA T/R |
1N4699D | rochester electronics | |
DW-50-07-G-S-200 | samtec inc. | Conn Board Stacker HDR 50 POS 2.54mm Solder ST Thru-Hole |
70V7319S133BFI | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 4M-Bit 256K x 18 15ns/4.2ns 208-Pin CABGA |
RF2694-000 | te connectivity / raychem circuit protection | RESET,60V,40A,1.1A IHLD,2.2A ITRP,RADIAL,AMMO,HAZMAT |
DW-50-11-G-D-665 | samtec inc. | Conn Board Stacker HDR 100 POS 2.54mm Solder ST Thru-Hole |
1N4743ARL | rochester electronics | |
70V7319S166BF8 | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 4M-Bit 256K x 18 12ns/3.6ns 208-Pin CABGA T/R |
RF2714-000 | te connectivity / raychem circuit protection | PTC Resettable Fuse 40A 72V |
DW-50-11-G-S-700 | samtec inc. | Conn Board Stacker HDR 50 POS 2.54mm Solder ST Thru-Hole |
1N5059 | rochester electronics | |
70V9179L7PF8 | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 288K-Bit 32K x 9-Bit 18ns/7.5ns 100-Pin TQFP T/R |
DW-50-13-G-S-930 | samtec inc. | Conn Board Stacker HDR 50 POS 2.54mm Solder ST Thru-Hole |
RF1175-000 | te connectivity / raychem circuit protection | RESET,72V,40A,1.85A IHLD,3.7A ITRP,RDL,KINK,.167ZZZ LL,HAZMAT |
70V9279L12PRF | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 512K-Bit 32K x 16 25ns/12ns 128-Pin TQFP |
1N5060 | rochester electronics | |
DW-50-13-T-D-890 | samtec inc. | Conn Board Stacker HDR 100 POS 2.54mm Solder ST Thru-Hole |
712TNM4-6 | teledyne relays | Electromechanical Relay DPDT 1ADC/0.25AAC 6VDC 98Ohm Through Hole |
RF2691-000 | te connectivity / raychem circuit protection | PTC Resettable Fuse 40A 72V T/R |
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