规格参数 > 第10408页
TR/3216CP-750MA 现货价格参数; 3090R-103F 现货价格参数; CDR01BX222BKSS 现货价格参数; PXF4048S12-HFP 现货价格参数; 3090R-151G 现货价格参数; TR2-6125FF8-R 现货价格参数; CDR01BX271BKUR1 现货价格参数; 3090R-332G 现货价格参数; PXF4048T0512-HFP 现货价格参数; CDR01BX821BKWMM 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| TR/3216CP-750MA | cooper bussmann | Fuse Chip 0.75A 24V 2-Pin Solder Pad Surface Mount T/R |
| 3090R-103F | api delevan | Ind RF Chip Unshielded Wirewound 10uH 1% 7.9MHz 20Q-Factor Powdered Iron 120mA T/R |
| CDR01BX222BKSS | avx | Cap Ceramic 0.0022uF 100V X7R 10% SMD 0805 (0.001%FR) 125°C Bulk |
| PXF4048S12-HFP | tdk-lambda | Module DC-DC 1-OUT 12V 3.333A 40W 9-Pin |
| 3090R-151G | api delevan | Ind RF Chip Unshielded Wirewound 150nH 2% 25MHz 32Q-Factor Powdered Iron 795mA T/R |
| TR2-6125FF8-R | cooper bussmann | BRICK FUSE-FAST ACTING |
| CDR01BX271BKUR1 | avx | SMP MLC HI-REL |
| 3090R-332G | api delevan | Ind RF Chip Unshielded Wirewound 3.3uH 2% 7.9MHz 25Q-Factor Powdered Iron 200mA T/R |
| PXF4048T0512-HFP | tdk-lambda | Module DC-DC 3-OUT 5V/12V/-12V 6A/0.4A/-0.4A 40W 9-Pin |
| CDR01BX821BKWMM | avx | Cap Ceramic 820pF 100V X7R 10% SMD 0805 (1%FR) 125°C Plastic T/R |
| TR2-C515-1-R | cooper bussmann | Fuse Subminiature 1A 250V Slow Blow 2-Pin Axial Through Hole T/R |
| 3090R-562K | api delevan | Ind RF Chip Unshielded Wirewound 5.6uH 10% 7.9MHz 22Q-Factor Powdered Iron 145mA T/R |
| SI4831DY-T1 | Vishay/Siliconix | MOSFET 30V 5A 2W |
| CDR02BX103BMUPM | avx | Cap Ceramic 0.01uF 100V X7R 20% SMD 1805 (0.1%FR) 125°C Plastic T/R |
| 3090R-820J | api delevan | Ind RF Chip Unshielded Wirewound 82nH 5% 50MHz 25Q-Factor Powdered Iron 630mA T/R |
| TR2-C515-1-25-R | cooper bussmann | Fuse Miniature 1.25A 250V Slow Blow 2-Pin Axial Through Hole T/R |
| CDR02BX123AKUS | avx | Cap Ceramic 0.012uF 50V X7R 10% SMD 1805 (0.001%FR) 125°C Bulk |
| 3094-184FS | api delevan | Ind RF Chip Unshielded Wirewound 180uH 1% 790KHz 40Q-Factor Iron 52mA T/R |
| Q24S25018-NS00G | power-one | Module DC-DC 1-OUT 1.8V 25A 8-Pin Quarter-Brick |
| CDR02BX183AKUM | avx | Cap Ceramic 0.018uF 50V X7R 10% SMD 1805 (1%FR) 125°C Bulk |
| 3094-472FS | api delevan | Ind RF Chip Unshielded Wirewound 4.7uH 1% 7.9MHz 60Q-Factor Iron 170mA T/R |
| TR2-C515-2-5-R | cooper bussmann | Fuse Subminiature 2.5A 250V Slow Blow 2-Pin Axial Through Hole T/R |
| Q24S25020-NS0PG | power-one | DCDC,HAZMAT |
| 3094-681KS | api delevan | Ind RF Chip Unshielded Wirewound 680nH 10% 25MHz 70Q-Factor Iron 430mA T/R |
| CDR02BX223AKSRM | avx | Cap Ceramic 0.022uF 50V X7R 10% SMD 1805 (0.01%FR) 125°C Plastic T/R |
| Q24S30018-NS00G | power-one | Module DC-DC 1-OUT 1.8V 30A 8-Pin Quarter-Brick |
| TR2-C515-375-R | cooper bussmann | Fuse Subminiature 0.375A 250V Slow Blow 2-Pin Axial Through Hole T/R |
| 3094-683GS | api delevan | Ind RF Chip Unshielded Wirewound 68uH 2% 2.5MHz 65Q-Factor Iron 67mA T/R |
| CDR02BX223AKUPM250 | avx | Cap Ceramic 0.022uF 50V X7R 10% SMD 1805 (0.1%FR) 125°C Plastic T/R |
| 3094R-152GS | api delevan | Ind RF Chip Unshielded Wirewound 1.5uH 2% 7.9MHz 65Q-Factor Iron 290mA T/R |
| CDR02BX472BKUMM | avx | Cap Ceramic 0.0047uF 100V X7R 10% SMD 1805 (1%FR) 125°C Plastic T/R |
| Q24S30020-NS0PG | power-one | DCDC,HAZMAT |
| TR2-C515-6-R | cooper bussmann | Fuse Miniature 6A 125V Slow Blow 2-Pin Axial Through Hole T/R |
| 3094R-182GS | api delevan | Ind RF Chip Unshielded Wirewound 1.8uH 2% 7.9MHz 65Q-Factor Iron 260mA T/R |
| CDR02BX472BKUP1 | avx | SMP MLC HI-REL |
| Q24S30025-PS00G | power-one | Module DC-DC 1-OUT 2.5V 30A 8-Pin Quarter-Brick |
| CDR02BX822BKUR | avx | Cap Ceramic 0.0082uF 100V X7R 10% SMD 1805 (0.01%FR) 125°C Bulk |
| TR2-C515-600-R | cooper bussmann | Fuse Subminiature 0.6A 250V Slow Blow 2-Pin Axial Through Hole T/R |
| 3094R-394HS | api delevan | Ind RF Chip Unshielded Wirewound 390uH 3% 790KHz 40Q-Factor Iron 39mA T/R |
| Q24T15050-NBAPG | power-one | Module DC-DC 1-OUT 5V 15A 8-Pin Quarter-Brick |
| CDR03BP681BJUR1 | avx | SMP MLC HI-REL |
| 3094R-681JS | api delevan | Ind RF Chip Unshielded Wirewound 680nH 5% 25MHz 70Q-Factor Iron 430mA T/R |
| TR2/C515-7-R | cooper bussmann | Fuse Miniature 7A 125V Slow Blow 2-Pin Axial Through Hole T/R |
| CDR03BX273BKSR | avx | Cap Ceramic 0.027uF 100V X7R 10% SMD 1808 (0.01%FR) 125°C Bulk |
| 30LJQ150SCX | international rectifier | Diode Schottky 150V 30A 3-Pin SMD-0.5 |
| Q24T15050-NBB0G | power-one | Module DC-DC 1-OUT 5V 15A 8-Pin Quarter-Brick |
| TR2-C515-800-R | cooper bussmann | Fuse Subminiature 0.8A 250V Slow Blow 2-Pin Axial Through Hole T/R |
| 322333 | te connectivity / amp | Ring Tongue Terminal 14-16AWG 16.15mm 8.71mm Loose Piece |
| C1808P333K1XPL | kemet | Cap Ceramic 0.033uF 100V X7R 10% SMD 1808 (0.1%FR) 125°C Bulk |
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