规格参数 > 第100889页
3090-151K 现货价格参数; R542-000-084 现货价格参数; TMM-143-01-TM-S-RA 现货价格参数; 3090-181G 现货价格参数; 1414N4PHSSC4LP 现货价格参数; TMM-143-01-TM-S-RA-006 现货价格参数; 3090-181H 现货价格参数; 1551NBK 现货价格参数; TMM-143-01-TM-S-RA-008 现货价格参数; 3090-181K 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| 3090-151K | api delevan | Ind RF Chip Unshielded Wirewound 150nH 10% 25MHz 32Q-Factor Powdered Iron 795mA T/R |
| R542-000-084 | Hammond Manufacturing | Enclosures, Boxes, & Cases RECESSED FRONTPLATE |
| TMM-143-01-TM-S-RA | samtec inc. | Conn Unshrouded Header HDR 43 POS 2mm Solder RA Thru-Hole |
| 3090-181G | api delevan | Ind RF Chip Unshielded Wirewound 180nH 2% 25MHz 32Q-Factor Powdered Iron 765mA T/R |
| 1414N4PHSSC4LP | Hammond Manufacturing | Enclosures, Boxes, & Cases 1414N4PH SS |
| TMM-143-01-TM-S-RA-006 | samtec inc. | Conn Unshrouded Header HDR 43 POS 2mm Solder RA Thru-Hole |
| 3090-181H | api delevan | Ind RF Chip Unshielded Wirewound 180nH 3% 25MHz 32Q-Factor Powdered Iron 765mA T/R |
| 1551NBK | Hammond Manufacturing | Enclosures, Boxes, & Cases 1.38 x 1.38 x 0.59 |
| TMM-143-01-TM-S-RA-008 | samtec inc. | Conn Unshrouded Header HDR 43 POS 2mm Solder RA Thru-Hole |
| 3090-181K | api delevan | Ind RF Chip Unshielded Wirewound 180nH 10% 25MHz 32Q-Factor Powdered Iron 765mA T/R |
| 74LVC74ABQ-G | NXP Semiconductors | Flip Flops DUAL D-TYPE FLIPFLOP |
| TMM-143-01-TM-S-RA-013 | samtec inc. | Conn Unshrouded Header HDR 43 POS 2mm Solder RA Thru-Hole |
| 3090-182H | api delevan | Ind RF Chip Unshielded Wirewound 1.8uH 3% 7.9MHz 24Q-Factor Powdered Iron 245mA T/R |
| EJ10125 | Hammond Manufacturing | Electrical Enclosures 10 X 12 X 5 W/PANEL |
| TMM-143-01-TM-S-RA-021 | samtec inc. | Conn Unshrouded Header HDR 43 POS 2mm Solder RA Thru-Hole |
| 3090-220J | api delevan | Ind RF Chip Unshielded Wirewound 22nH 5% 50MHz 40Q-Factor Powdered Iron 765mA T/R |
| SNB-3738 | Bud Industries | Enclosures, Boxes, & Cases 7.87x 5.91x 5.91 |
| TMM-143-01-TM-S-RA-023 | samtec inc. | Conn Unshrouded Header HDR 43 POS 2mm Solder RA Thru-Hole |
| 3090-221K | api delevan | Ind RF Chip Unshielded Wirewound 220nH 10% 25MHz 34Q-Factor Powdered Iron 690mA T/R |
| ER-16511-BT | Bud Industries | Racks & Rack Cabinets ECONOMIZER RACK |
| TMM-143-01-TM-S-RA-025 | samtec inc. | Conn Unshrouded Header HDR 43 POS 2mm Solder RA Thru-Hole |
| 3090-222G | api delevan | Ind RF Chip Unshielded Wirewound 2.2uH 2% 7.9MHz 25Q-Factor Powdered Iron 240mA T/R |
| 137-008 | Altech | Enclosures, Boxes, & Cases Polycarb, Trans, M Knockouts |
| TMM-143-01-TM-S-RA-028 | samtec inc. | Conn Unshrouded Header HDR 43 POS 2mm Solder RA Thru-Hole |
| 3090-222J | api delevan | Ind RF Chip Unshielded Wirewound 2.2uH 5% 7.9MHz 25Q-Factor Powdered Iron 240mA T/R |
| 201-504-91 | Altech | Enclosures, Boxes, & Cases Enclosure,PC,Trans Lid |
| TMM-143-01-TM-S-RA-030 | samtec inc. | Conn Unshrouded Header HDR 43 POS 2mm Solder RA Thru-Hole |
| 3090-222K | api delevan | Ind RF Chip Unshielded Wirewound 2.2uH 10% 7.9MHz 25Q-Factor Powdered Iron 240mA T/R |
| ESD30208CG | Hammond Manufacturing | Electrical Enclosures ECL N12 1 DR. WLMNT |
| TMM-143-01-TM-S-RA-032 | samtec inc. | Conn Unshrouded Header HDR 43 POS 2mm Solder RA Thru-Hole |
| 3090-271G | api delevan | Ind RF Chip Unshielded Wirewound 270nH 2% 25MHz 34Q-Factor Powdered Iron 615mA T/R |
| 1418G6 | Hammond Manufacturing | Electrical Enclosures NEMA12 PNL 16X16X6 |
| TMM-143-01-TM-S-RE | samtec inc. | Conn Unshrouded Header HDR 43 POS 2mm Solder RA Thru-Hole |
| 3090-271H | api delevan | Ind RF Chip Unshielded Wirewound 270nH 3% 25MHz 34Q-Factor Powdered Iron 615mA T/R |
| PTN0603H7411BBT1 | vishay / dale | Res Thin Film 0603 7.41K Ohm 0.1% 3/20W ±50ppm/°C Molded SMD SMD T/R |
| TMM-144-01-F-D-RA | samtec inc. | Conn Unshrouded Header HDR 88 POS 2mm Solder RA Thru-Hole |
| 3090-272H | api delevan | Ind RF Chip Unshielded Wirewound 2.7uH 3% 7.9MHz 25Q-Factor Powdered Iron 225mA T/R |
| IMESD166 | Hammond Manufacturing | Electrical Enclosure Accessories 1600X600 IME DOOR |
| TMM-144-01-F-D-RA-001 | samtec inc. | Conn Unshrouded Header HDR 88 POS 2mm Solder RA Thru-Hole |
| 3090-332F | api delevan | Ind RF Chip Unshielded Wirewound 3.3uH 1% 7.9MHz 25Q-Factor Powdered Iron 200mA T/R |
| PTN0603H7412BST1 | vishay / dale | Res Thin Film 0603 74.1K Ohm 0.1% 3/20W ±50ppm/°C Molded SMD SMD T/R |
| 3090-332H | api delevan | Ind RF Chip Unshielded Wirewound 3.3uH 3% 7.9MHz 25Q-Factor Powdered Iron 200mA T/R |
| TMM-144-01-F-D-RA-003 | samtec inc. | Conn Unshrouded Header HDR 88 POS 2mm Solder RA Thru-Hole |
| PTN0603H7500BBT0 | vishay / dale | Res Thin Film 0603 750 Ohm 0.1% 3/20W ±50ppm/°C Molded SMD SMD T/R |
| 3090-391F | api delevan | Ind RF Chip Unshielded Wirewound 390nH 1% 25MHz 34Q-Factor Powdered Iron 500mA T/R |
| TMM-144-01-F-D-RA-004 | samtec inc. | Conn Unshrouded Header HDR 88 POS 2mm Solder RA Thru-Hole |
| 3090-391G | api delevan | Ind RF Chip Unshielded Wirewound 390nH 2% 25MHz 34Q-Factor Powdered Iron 500mA T/R |
| TMM-144-01-F-D-RA-014 | samtec inc. | Conn Unshrouded Header HDR 88 POS 2mm Solder RA Thru-Hole |
| PTN0603H7500BBT1 | vishay / dale | Res Thin Film 0603 750 Ohm 0.1% 3/20W ±50ppm/°C Molded SMD SMD T/R |
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